Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield [Second Edition] - Harman, George

Interior clean and unmarked, except for previous owner's name in ink to endpaper. Some rubbing and bumping to boards, two corners worn through.

Title: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield [Second Edition]

Publisher: McGraw-Hill Professional

Publication Date: 1997

Binding: Hardcover

Condition: Good